Vacuum installation for film deposition by magnetron sputtering

MAGNA TM 22

Purpose:

Deposition of multicomponent and multilayer metal or dielectric thin films on substrates (plates) by magnetron sputtering.

Special characteristics:

 Scheme

• Group processing of Ø 76 or Ø 100 mm substrates;
• Lock-chamber for loading and unloading of substrates;
• Planetary two-stage substrate holder;
• Preliminary substrate heating and cleaning by ion source in lock chamber;
• Film deposition in working chamber by 1, 2, 3 or 4 magnetrons;
• Oil-free (dry) pumping system (turbomolecular or cryogenic, forevacuum pumps);
• Microprocessing control system;
• Consumed power not more than 20 kW;
• 2,5 m² area per one plant.