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MAGNA ТМ 22

Vacuum installation for film deposition by magnetron sputtering

магна тм 22_1

Purpose:

Deposition of multicomponent and multilayer metal or dielectric thin films on substrates (plates) by magnetron sputtering.

Special characteristics:

  • Group processing of Ø 76 or Ø 100 mm substrates;
  • Lock-chamber for loading and unloading of substrates;
  • Planetary two-stage substrate holder;
  • Preliminary substrate heating and cleaning by ion source in lock chamber;
  • Film deposition in working chamber by 1, 2, 3 or 4 magnetrons;
  • Oil-free (dry) pumping system (turbomolecular or cryogenic, forevacuum pumps);
  • Microprocessing control system;
  • Consumed power not more than 20 kW;
  • 2,5 m2 area per one plant.

magna tm 22 foto 2magna22   

 

 

 

 

 

 

 

 

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