VACUUM INSTALLATION FOR FILM DEPOSITION BY CONTINIOUS MAGNETRON SPUTTERING

MAGNA TM 29

Purpose:

Deposition of multicomponent and multilayer metal or dielectric thin films on substrates (plates) by magnetron sputtering.

ОСОБЕННОСТИ

СХЕМА УСТАНОВКИ

• In-process plates diameter: 76, 100, 150 mm;
• Two lock-chambers for loading and unloading of substrates;
• Conveyor system for substrate transportation from one plate holder to another;
• Preliminary substrates heating via lamp heater and cleaning via ion source;
• Oil-free (dry) pumping system (turbomolecular or cryogenic, forevacuum pumps);
• Microprocessing control system;
• Consumed power not more than 25 kW;
• 10 m² area per one plant.