4-POSITION VACUUM INSTALLATION
FOR FILM DEPOSITION BY MAGNETRON SPUTTERING
WITH LOAD LOCK

MAGNA TM 5

Purpose:

The deposition of multicomponent and multilayer metal or dielectric thin films on substrates (plates) by magnetron sputtering.

SPECIAL CHARACTERISTICS

INSTALLATION SCHEME

• Group processing of substrates in one technological cycle:
• Ø 76mm — 15 pcs.; Ø 100mm — 9 pcs .; Ø 150mm — 3 pcs.;
• Airlock for loading — unloading substrates (Position 1);
• System for transferring substrates from the lock chamber to three working positions (2,3,4) by a transport carousel;
• Multi-cathode MRU with three targets Ø100mm (Position 3.4);
• Preheating the substrates and cleaning them with an ion source (Position 2);
• Oil-free pumping system;
• Power consumption is not more than 20 kW.