Small-scale vacuum installation for film deposition by magnetron sputtering and thermal evaporation
Deposition of metal films, resistive materials and dielectrics.
- Magnetron sputtering device — 1 pc.;
- Thermal evaporator – 1 pc.;
- Substrate processing in one technological cycle (single-sided processing): Ø 100 mm –4 pcs.;
- Periodical quarter-turn of substrate holder;
- Microprocessing control system;
- Oil-free pumping system (turbomolecular pumps 300 l/h);
- Consumed power not more than 4,5 kW;
- 2,5 m2 area per one plant.