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MVU TM MAGNA TIS 02

              мву тм тисмагна_1                

Small-scale vacuum installation for film deposition by magnetron sputtering and thermal evaporation

MVU TM MAGNA TIS 02

Purpose:

Deposition of metal films, resistive materials and dielectrics.

мву тм тисмагна_2

Special characteristics

 Scheme

  • Magnetron sputtering device — 2 pcs.;
  • Thermal evaporator — 1 pc.;
  • Substrate processing in one technological cycle (single-sided processing): Ø 100 mm –4 pcs.;
  • Periodical quarter-turn of substrate holder;
  • Microprocessing control system;
  • Oil-free pumping system (turbomolecular pumps 300 l/h);
  • Consumed power not more than 4,5 kW;
  • 2,5 marea per one plant.
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