Small – scale installation for film deposition by magnetron sputtering
Purpose:
Deposition of metal films, resistive materials and dielectrics by magnetron sputtering.
Special characteristics:
- Type and quantity of magnetron sputtering device in the installation: magna 01, 06 – 1 of DC magnetron sputtering device, magna 03 — 1 pc of HF magnetron sputtering device;
- Substrate processing in one technological cycle (single-sided processing): Ø 100 mm –4 pcs;
- Periodical quarter-turn of substrate holder;
- Microprocessing control system;
- magna 01, 03 — oil-free pumping system (turbomolecular pumps 60 l/h);
- magna 06 — oil-free pumping system (turbomolecular pumps 300 l/h);
- Consumed power not more than 4,5 kW;
- 2,5 m2 area per one plant.
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