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MVU TM MAGNA 02

Small – scale installation for film deposition by magnetron sputtering

мву тм магна 02

Purpose:

Deposition of metal films and resistive materials by magnetron sputtering.

Special characteristics:

  • Type and quantity of magnetron sputtering device in the installation: DC magnetron sputtering device — 1 pc.;
  • Substrate processing in one technological cycle (single-sided processing): Ø 150 mm – 2 pcs.;
  • Periodical half turnof substrate holder;
  • Microprocessing control system;
  • Oil-free pumping system (turbomolecular pumps 60 l/h);
  • Consumed power not more than 4,5 kW;
  • 2,5 m2 area per one plant.

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