Small – scale installation for film deposition by magnetron sputtering
Purpose:
Deposition of metal films and resistive materials by magnetron sputtering.
Special characteristics:
- Type and quantity of magnetron sputtering device in the installation: DC magnetron sputtering device — 1 pc.;
- Substrate processing in one technological cycle (single-sided processing): Ø 150 mm – 2 pcs.;
- Periodical half turnof substrate holder;
- Microprocessing control system;
- Oil-free pumping system (turbomolecular pumps 60 l/h);
- Consumed power not more than 4,5 kW;
- 2,5 m2 area per one plant.
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