Small – scale installation for film deposition by magnetron sputtering

MVU TM MAGNA 04

Purpose:

Deposition of metal films and resistive materials by magnetron sputtering.

Special characteristics:

Scheme

• Type and quantity of magnetron sputtering device in the installation: DC magnetron sputtering device — 2;
• Substrate processing in one technological cycle (double-sided processing): 60 x 48 mm – 6 pcs.;
• Microprocessing control system;
• Oil-free pumping system (turbomolecular pumps 300 l/h);
• Consumed power not more than 4,5 kW;
• 2,5 m² area per one plant.