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Small – scale installation for film deposition by magnetron sputtering with load lock

мву тм магна 09


Double-sided deposition of multicomponent and multilayer metal thin films on substrates (plates) by magnetron sputtering.

Special characteristics:

  • Single-piece processing of substrates: Ø 100, 150, 200 mm or 5 pcs. 60 x 48 mm;
  • Lock-chamber for loading and unloading of substrates;
  • Preliminary substrate heating and cleaning in HF discharge plasma before deposition;
  • Substrate transfer system from lock chamber to working chamber by horizontal movement device;
  • Magnetron sputtering device with three Ø100 mm targets;
  • Rotating shutter with window;
  • Deposition of metal layers in DC- mode;
  • Deposition dielectric layers in HF-mode;
  • Oil-free (dry) pumping system (forvacuum and turbomolecular pumps);
  • The ability to embed into clean room;
  • Microprocessing control system;
  • Consumed power not more than 14 kW;
  • 4,5 m2 area per one plant.

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