Small – scale installation for film deposition by magnetron sputtering with load lock

MVU TM MAGNA 09

Purpose:

Double-sided deposition of multicomponent and multilayer metal thin films on substrates (plates) by magnetron sputtering.

Special characteristics

Scheme

• Single-piece processing of substrates: Ø 100, 150, 200 mm or 5 pcs. 60 x 48 mm;
• Lock-chamber for loading and unloading of substrates;
• Preliminary substrate heating and cleaning in HF discharge plasma before deposition;
• Substrate transfer system from lock chamber to working chamber by horizontal movement device;
• Magnetron sputtering device with three Ø100 mm targets;
• Rotating shutter with window;
• Deposition of metal layers in DC- mode;
• Deposition dielectric layers in HF-mode;
• Oil-free (dry) pumping system (forvacuum and turbomolecular pumps);
• The ability to embed into clean room;
• Microprocessing control system;
• Consumed power not more than 14 kW;
• 4,5 m² area per one plant.