Small – scale installation for film deposition by magnetron sputtering

MVU TM MAGNA 11, 12

Purpose:

Deposition of metal films, resistive materials and dielectrics by magnetron sputtering.

Special characteristics

Scheme

• Type and quantity of magnetron sputtering device in the installation: MAGNA 11 – 2 pcs. of DC magnetron sputtering device, MAGNA 12 — 1 pc. of DC magnetron sputtering device, 1 pc. of HF magnetron sputtering device;
• Substrate processing in one technological cycle (single-sided processing): Ø 100 mm – 4 pcs., (Ø 150 mm – 2 pcs. using another substrate holder);
• Periodical quarter-turn of substrate holder;
• Quantity of ion source – 1 pc.;
• Microprocessing control system;
• Oil-free pumping system (turbomolecular pumps 300 l/h);
• Consumed power not more than 4,5 kW;
• 2,5 m² area per one plant.