Small-scale installation for thermal processing of plates and materials in gas environment
Purpose:
Automatic thermal processing of plates and materials (annealing, drying, diffusant rectification, reconstruction of crystal structures) at standard pressure in reducing or neutral environment.
Special characteristics:
- Group processing of 120 substrates up to Ø 100 mm;
- Quartz reactor with sealed working area of 700 mm;
- Working temperature range 300 – 1100 °C;
- Working gases – Ar, O2, N2;
- Microprocessing control system;
- Consumed power not more than 15 kW;
- The ability to embed into clean room;
- 3 m2 area per one plant.