Small-scale installation
for thermal processing of plates and materials
in high vacuum and gas environment

OTJIG TM 4

Purpose:

Automatic thermal processing of plates and materials (annealing, drying,
diffusant rectification, reconstruction of crystal structures) at standard
pressure in oxidative or neutral environment.

Special characteristics

Scheme

• Group processing of 120 substrates up to Ø 100 mm;
• Quartz reactor with sealed working area of 700 mm;
• Working temperature range 300 – 1100 °C;
• Working gases – Ar, H₂;
• Microprocessing control system;
• Consumed power not more than 15 kW;
• The ability to embed into clean room;
• 3 m² area per one plant.