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SMR 01

Magnetron sputtering system



Multicathode sputtering device with power supply and management rack is intended for the sequential deposition of three different materials onto silicon wafers by magnetron sputtering.

Special characteristics:

  • Number of consistently working magnetrons – 3 pcs.;
  • Operational power of each magnetron 100 -2000 W;
  • Ability to clean the working surface of the target of each magnetron («training») at the closed valve;
  • Consumed power not more than 3 kW
  • Weight – 61,5 kg.

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