Magnetron sputtering system
Purpose:
Multicathode sputtering device with power supply and management rack is intended for the sequential deposition of three different materials onto silicon wafers by magnetron sputtering.
Special characteristics:
- Number of consistently working magnetrons – 3 pcs.;
- Operational power of each magnetron 100 -2000 W;
- Ability to clean the working surface of the target of each magnetron («training») at the closed valve;
- Consumed power not more than 3 kW
- Weight – 61,5 kg.
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