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RUS
RESEARCH INSTITUTE OF PRECISION MACHINE MANUFACTURING
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ELIM ТМ 5
Four-position vacuum installation for film deposition by magnetron sputtering and electron-beam evaporation with load lock
ELIM TM 5
Purpose:
Deposition of metal films, resistive materials and dielectrics.
Special characteristics:
Scheme
Group processing of substrates in one technological cycle: Ø 76 mm – 15 pcs., Ø 100 mm – 9 pcs., Ø 150 mm – 3 pcs.;
Lock-chambers for loading and unloading of substrates (Position 1);
Substrate transfer system from lock chamber to two work position (2, 3) by transport carrousel;
Multi-cathode magnetron sputtering device with three Ø 100 mm targets;
4-crucible electron-beam evaporators;
Preliminary substrate heating and cleaning by ion source;
Oil-free (dry) pumping system (turbomolecular or cryogenic, forevacuum pumps);
Microprocessing control system;
Consumed power not more than 20 kW;
6 m
2
area per one plant.