+7 (495) 229-7501    |    info@niitm.ru    |        |    RUS

ELIM ТМ 5

Four-position vacuum installation for film deposition by magnetron sputtering and electron-beam evaporation with load lock

элим тм 5_1

Purpose:

Deposition of metal films, resistive materials and dielectrics.

Special characteristics:

  • Group processing of substrates in one technological cycle: Ø 76 mm – 15 pcs., Ø 100 mm – 9 pcs., Ø 150 mm – 3 pcs.;
  • Lock-chambers for loading and unloading of substrates (Position 1);
  • Substrate transfer system from lock chamber to two work position (2, 3) by transport carrousel;
  • Multi-cathode magnetron sputtering device with three Ø 100 mm targets;
  • 4-crucible electron-beam evaporators;
  • Preliminary substrate heating and cleaning by ion source;
  • Oil-free (dry) pumping system (turbomolecular or cryogenic, forevacuum pumps);
  • Microprocessing control system;
  • Consumed power not more than 20 kW;
  • 6 m2 area per one plant.

elim tm 5 foto_2      элим

9c58e38e9870c3807495c61427c56ed5  Download PDF