Four-position vacuum installation for film deposition by magnetron sputtering and electron-beam evaporation with load lock

ELIM TM 5

Purpose:

Deposition of metal films, resistive materials and dielectrics.

Special characteristics:

Scheme

• Group processing of substrates in one technological cycle: Ø 76 mm – 15 pcs., Ø 100 mm – 9 pcs., Ø 150 mm – 3 pcs.;
• Lock-chambers for loading and unloading of substrates (Position 1);
• Substrate transfer system from lock chamber to two work position (2, 3) by transport carrousel;
• Multi-cathode magnetron sputtering device with three Ø 100 mm targets;
• 4-crucible electron-beam evaporators;
• Preliminary substrate heating and cleaning by ion source;
• Oil-free (dry) pumping system (turbomolecular or cryogenic, forevacuum pumps);
• Microprocessing control system;
• Consumed power not more than 20 kW;
• 6 m² area per one plant.