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Vacuum installation for film deposition by magnetron sputtering with load lock

  магна тм 200


Deposition of multicomponent and multilayer metal or dielectric thin films on substrates (plates) by magnetron sputtering.

Special characteristics:

  • Substrate processing in one technological cycle: 60 x 48 mm – 3 pcs., Ø 76, 100, 150, 200 mm – 1 pc.;
  • Lock-chamber for loading and unloading of substrates;
  • Substrate transfer system from lock chamber to working chamber by manipulator;
  • Planar magnetron sputtering device with Ø 280 mm target and multi-cathode magnetron sputtering device with three Ø100 mm targets;
  • High-speed deposition of one film by three magnetrons or sequential deposition of 2, 3, 4-layer films using the shutter;
  • Rotary HF electrode with substrate heating and cleaning in HF plasma;
  • Oil-free (dry) pumping system (forevacuum and turbomolecular pumps);
  • Microprocessing control system;
  • Consumed power not more than 16 kW;
  • 5 m2 area per one plant.


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