Vacuum installation of film deposition by magnetron sputtering with rotary loading

MAGNA TM 200-01K

Purpose

Deposition of multicomponent and multilayer metal or dielectric thin films on substrates (plates) by magnetron sputtering.

Special characteristics:

СХЕМА УСТАНОВКИ

• Individual treatment of substrates in one production cycle: Ø 100, 150, 200mm – 1 pcs.
• Lock-chamber for loading and unloading substrates from cassette to cassette
• Transport system for transferring substrates from lock chamber to working chamber by manipulator;
• Installation of the ion source for substrate cleaning instead of the third magnetron evaporator;
• Planar magnetron evaporator with ø280mm target and multi-cathode magnetron evaporator with three ø100mm targets;
• One film high-speed deposition of three magnetrons or sequential deposition of two-three layers films using shutter;
• Oil-free (dry) pumping system (forvacuum and turbomolecular pumps);
• Microprocessor control system;
• Power consumption is not more than 16 kWt;
• Ability to build in a clean room;
• 5m² area per one plant.