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MAGNA TM 7

магна тм 7-1

4-position vacuum installation for film deposition by magnetron sputtering

MAGNA TM 7

Purpose:

Deposition of multicomponent and multilayer metal or dielectric thin films on substrates (plates) by magnetron sputtering.

магна тм 7-2

Special characteristics

 Scheme

  • 2 magnetron sputtering devices;
  • processing in one technological cycle (one-sided): 60 x 48 mm –17 pc.;
  • Substrate heating up to 300° C;
  • Control of resistive film thickness by resistance;
  • Preliminary substrate heating and cleaning by ion source;
  • Ion sources – 1 pc.;
  • Oil-free pumping system (turbomolecular pump);
  • Microprocessing control system;
  • Consumed power not more than 4,5 kW;
  • 3 m2 area per one plant.