+7 (495) 229-7501    |    info@niitm.ru    |        |    RUS

MAGNA TM 7

4-position vacuum installation for film deposition by magnetron sputtering

 

 

Purpose:

Deposition of multicomponent and multilayer metal or dielectric thin films on substrates (plates) by magnetron sputtering.

Special characteristics:

  • 2 magnetron sputtering devices;
  • processing in one technological cycle (one-sided): 60 x 48 mm –17 pc.;
  • Substrate heating up to 300° C;
  • Control of resistive film thickness by resistance;
  • Preliminary substrate heating and cleaning by ion source;
  • Ion sources – 1 pc.;
  • Oil-free pumping system (turbomolecular pump);
  • Microprocessing control system;
  • Consumed power not more than 4,5 kW;
  • 3 m2 area per one plant.

       

9c58e38e9870c3807495c61427c56ed5  Download PDF