4-position vacuum installation for film deposition by magnetron sputtering

MAGNA TM 7

Purpose:

Deposition of multicomponent and multilayer metal or dielectric thin films on substrates (plates) by magnetron sputtering.

Special characteristics

 Scheme

• 2 magnetron sputtering devices;
• processing in one technological cycle (one-sided): 60 x 48 mm –17 pc.;
• Substrate heating up to 300° C;
• Control of resistive film thickness by resistance;
• Preliminary substrate heating and cleaning by ion source;
• Ion sources – 1 pc.;
• Oil-free pumping system (turbomolecular pump);
• Microprocessing control system;
• Consumed power not more than 4,5 kW;
• 3 m² area per one plant.