ISOPHASE TM 200-01
Атомно-слоевое осаждение сверхтонких пленок.
Specifications:
The ability to be part of a cluster
—
Yes
Possibility of integration into a clean room
—
Yes
Wafer diameter
—
Up to 100mm, 150mm, 200mm
Wafer loading
—
From cassette to cassette, Loadlock, SMIF container
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ISOPHASE TM 200-01
Specifications:
- Wafers processing on the work table: Ø 76, 100, 150, 200 mm;
- Wafers transport system based on a manipulator;
- Various versions of the loading system: loadlock, from cassette to cassette, SMIF container;
- Loadlock chamber for loading and unloading substrates or wafers;
- Deposition in thermal mode with a remote ICP plasma source;
- Ports for connecting ampoules with a precursor:
- with high saturated vapor pressure - 2 pcs.;
- with low saturated vapor pressure - 2 pcs. (optional up to 4 pcs.);
- Power consumption no more than 14 kW;
- Oil-free pumping system;
- Possibility of integration into a clean room.
Warranty and post-warranty service;
The possibility of upgrading and reconfiguring equipment to meet customer requirements.