The ability to be part of a cluster
Yes
Possibility of integration into a clean room
Yes
Wafer diameter
Up to 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Ion-alloyed layers annealing; ohmic contacts formation; metal silicides, thin oxide and dielectric films production; amorphous and polycrystalline films recrystallization, etc.
The ability to be part of a cluster
Yes
Possibility of integration into a clean room
Yes
Wafer diameter
Up to 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Magnetron sputtering of aluminum (Al) metallization, formation of adhesive, barrier (Ta/TaN, Ti/TiN) and nucleated copper (Cu) layers for bridges in contact and via holes of interlayer joints, etc.
The ability to be part of a cluster
Yes
Possibility of integration into a clean room
Yes
Wafer diameter
Up to 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Dielectric layers deposition with an ICP plasma source to form gap and interlayer insulation, including on the contact walls and via holes of interlayer connections
The ability to be part of a cluster
Yes
Possibility of integration into a clean room
Yes
Wafer diameter
Up to 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Атомно-слоевое осаждение сверхтонких пленок.
The ability to be part of a cluster
Yes
Possibility of integration into a clean room
Yes
Wafer diameter
Up to 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Atomic layer etching of silicon oxide, silicon and surface cleaning
The ability to be part of a cluster
Yes
Possibility of integration into a clean room
Yes
Wafer diameter
100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Highly selective processes of photoresist mask plasma-chemical removal and organic polymers etching
The ability to be part of a cluster
Yes
Possibility of integration into a clean room
Yes
Wafer diameter
Up to 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Deep plasma-chemical anisotropic etching of silicon in the MEMS, NEMS, 2.5D and 3D production, as well as through high-aspect holes, etc. based on the Bosch process.
The ability to be part of a cluster
Yes
Possibility of integration into a clean room
Yes
Wafer diameter
Up to 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Plasma-chemical etching of polycrystalline silicon and silicon nitride (fine-gap insulation in silicon).
Possibility of integration into a clean room
Yes
Wafer diameter
Up to 100mm, 150mm, 200mm
Wafer loading
Manual
Gas-phase deposition from metal-organic compounds for epitaxial growth of heterostructures based on III-N materials for power devices and UHF transistors