Wafer diameter
200mm, 300mm
Wafer loading
FOUP container, SMIF container
The cluster system is designed for plasma chemical deposition (CVD) with up to 65 nm design rules
Wafer diameter
200mm, 300mm
Wafer loading
FOUP container, SMIF container
The cluster system is designed for plasma chemical etching (RIE) with up to 65 nm design rules
Wafer diameter
Up to 100mm, 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Ion-alloyed layers annealing; ohmic contacts formation; metal silicides, thin oxide and dielectric films production; amorphous and polycrystalline films recrystallization, etc.
Wafer diameter
Up to 100mm, 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Magnetron sputtering of aluminum (Al) metallization, formation of adhesive, barrier (Ta/TaN, Ti/TiN) and nucleated copper (Cu) layers for bridges in contact and via holes of interlayer joints, etc.
Wafer diameter
Up to 100mm, 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Dielectric layers deposition with an ICP plasma source to form gap and interlayer insulation, including on the contact walls and via holes of interlayer connections
Wafer diameter
Up to 100mm, 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Plasma-enhanced atomic-layer deposition (PEALD)
Wafer diameter
Up to 100mm, 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Atomic layer etching of silicon oxide, silicon and surface cleaning
Wafer diameter
Up to 100mm, 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Highly selective processes of photoresist mask plasma-chemical removal and organic polymers etching
Wafer diameter
Up to 100mm, 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Deep plasma-chemical anisotropic etching of silicon in the MEMS, NEMS, 2.5D and 3D production, as well as through high-aspect holes, etc. based on the Bosch process.
Wafer diameter
Up to 100mm, 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Plasma-chemical etching of polycrystalline silicon and silicon nitride (fine-gap insulation in silicon).
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