PLASMA TM 200-03
Highly selective processes of photoresist mask plasma-chemical removal and organic polymers etching
Specifications:
The ability to be part of a cluster
—
Yes
Possibility of integration into a clean room
—
Yes
Wafer diameter
—
100mm, 150mm, 200mm
Wafer loading
—
From cassette to cassette, Loadlock, SMIF container
Цена действительна только для интернет-магазина и может отличаться от цен в розничных магазинах
PLASMA TM 200-03
Specifications:
- Wafer processing on the work table: Ø 76, 100, 150, 200 mm;
- Wafers transport system based on a manipulator;
- Various loading system options: loadlock, cassette-to-cassette, SMIF container;
- Heated work table up to 250°C;
- Remote UHF plasma source for radical etching;
- Working gases: He, SF6, C4F8, O2, Ar and others;
- Power consumption no more than 15.5 kW;
- Oil-free pumping system;
- Possibility of integration into a clean room.
Warranty and post-warranty service;
The possibility of upgrading and reconfiguring equipment to meet customer requirements.