PLASMA TM 200-01
Plasma-chemical etching of polycrystalline silicon and silicon nitride (fine-gap insulation in silicon).
Specifications:
The ability to be part of a cluster
—
Yes
Possibility of integration into a clean room
—
Yes
Wafer diameter
—
Up to 100mm, 150mm, 200mm
Wafer loading
—
From cassette to cassette, Loadlock, SMIF container
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PLASMA TM 200-01
Specifications:
- Wafers processing on the work table: Ø 76, 100, 150, 200 mm;
- Wafers transport system based on a manipulator;
- Various versions of the loading system: loadlock, from cassette to cassette, SMIF container;
- Loadlock chamber for loading and unloading substrates or wafers;
- Helium cooling and mechanical clamping of the substrate or wafer;
- Working gases: Cl2, HBr, SF6, CF4, O2, N2, He and others;
- Working gases: Cl2, HBr, SF6, CF4, O2, N2, He and others;
- Oil-free pumping system;
- Possibility of integration into a clean room.
Warranty and post-warranty service;
The possibility of upgrading and reconfiguring equipment to meet customer requirements.