ISOPHASE TM 200-02
Dielectric layers deposition with an ICP plasma source to form gap and interlayer insulation, including on the contact walls and via holes of interlayer connections
Specifications:
The ability to be part of a cluster
—
Yes
Possibility of integration into a clean room
—
Yes
Wafer diameter
—
Up to 100mm, 150mm, 200mm
Wafer loading
—
From cassette to cassette, Loadlock, SMIF container
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ISOPHASE TM 200-02
Specifications:
- Processing of wafers on the work table: Ø 76, 100, 150, 200 mm;
- Wafers transport system based on a manipulator;
- Various versions of the loading system: loadlock, from cassette to cassette, SMIF container;
- Loadlock chamber for loading and unloading substrates or wafers;
- Chemically resistant pumping system;
- Substrate holder temperature from 200 - 300 °C;
- Maximum power consumption no more than 18 kW;
- Possibility of integration into a clean room.
Warranty and post-warranty service;
The possibility of upgrading and reconfiguring equipment to meet customer requirements.