Wafer diameter
Up to 100mm, 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Dielectric layers deposition with an ICP plasma source to form gap and interlayer insulation, including on the contact walls and via holes of interlayer connections
Wafer diameter
Up to 100mm, 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Plasma-enhanced atomic-layer deposition (PEALD)