The ability to be part of a cluster
Yes
Possibility of integration into a clean room
Yes
Wafer diameter
Up to 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Dielectric layers deposition with an ICP plasma source to form gap and interlayer insulation, including on the contact walls and via holes of interlayer connections
The ability to be part of a cluster
Yes
Possibility of integration into a clean room
Yes
Wafer diameter
Up to 100mm, 150mm, 200mm
Wafer loading
From cassette to cassette, Loadlock, SMIF container
Атомно-слоевое осаждение сверхтонких пленок.