Possibility of integration into a clean room
Yes
Wafer diameter
200mm
Wafer loading
SMIF container
The cluster installation is designed to carry out the processes of plasma chemical etching of polysilicon to form circuit elements (gates of various types, slit insulation) by plasma chemical etching of silicon using a photoresistive mask and a rigid mask on functional substrates.
Possibility of integration into a clean room
Yes
Wafer diameter
200mm
Wafer loading
SMIF container
The cluster installation is designed to carry out the processes of plasma chemical etching (ICP RIE) of metallization layers for the formation of metal wiring elements by plasma chemical etching of Al (aluminum) using a photoresistive mask on functional substrates.