Possibility of integration into a clean room
Yes
Wafer diameter
200mm
Wafer loading
SMIF container
The cluster installation is designed to carry out the processes of plasma chemical etching (ICP RIE) of metallization layers for the formation of metal wiring elements by plasma chemical etching of Al (aluminum) using a photoresistive mask on functional substrates.
Possibility of integration into a clean room
Yes
Wafer diameter
200mm
Wafer loading
SMIF container
High-performance automated movement of plates with a diameter of 200 mm
Possibility of integration into a clean room
Yes
Wafer diameter
150mm
Wafer loading
SMIF container
Creation of thin metal films by magnetron sputtering in vacuum on semiconductor wafers with a diameter of 150 mm. The installation ensures the creation of conformal metal films in windows with a large aspect ratio.
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